Denselight's Soma Sankaran and Yee-Loy Lam to present their new trademarked DPhi technology at the Industrial Transformation Asia Pacific 2020 next week, an event sponsored by Hannover Messe.
Live Webinar: USING DPHI™ TECHNOLOGY TO ENABLE EMBEDDED SENSING. Packaging technology that helps transceiver manufacturers to achieve faster Time-to-Market in both Sensing & Datacom (400G/800) space. Hear about how DenseLight’s DPHI™ packaging technology enables agility, allows increased flexibility and helps customers to deliver new efficiencies.
Their DPhi packaging technology and process sounds vaguely familiar:
- Denselight InP Fab and Die tests
- add in Denselight InP lasers and backend processing
- get wafer from foundry partner
- wafer-scale assembly, singulation and testing
- optical engines assembled on wafer
- ready to use optical engine
It's hard to imagine POET is not on-board...
https://www.facebook.com/DenseLight/photos/a.1066318553718998/1280591728958345/?type=3&theater
https://www.industrial-transformation.com/registration
