Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Broadcom Co-packaged Platform Solutions

2021 EPIC Online Technology Meeting on Roadmap 2021 for Co-packaged Optics

 

https://www.epic-assoc.com/wp-content/uploads/2021/03/Vivek-Raghuraman_Broadcom.pdf

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