ICC News On June 25, Huagong Technology said on the interactive platform that the company officially launched the 1.6T-200G/L high-speed silicon photonics module solution at the 2024 OFC exhibition, and the product uses self-developed single-wave 200G silicon photonics chips and is compatible with thin-film lithium niobate modulators and quantum dot lasers.

The high-end wafer laser cutting intelligent equipment has completed product development and achieved delivery

In addition, some investors asked Huagong Technology on the interactive platform whether the Jingyuan cutting machine has begun mass production? Huagong Technology replied that the company has developed high-end wafer laser cutting intelligent equipment in the field of semiconductor applications, equipped to achieve automatic focusing, automatic positioning and automatic processing of 6-8 inch wafer full wafers and fragments, equipped with high-precision motion platform and high-stability laser and optical path system, which can realize laser non-destructive cutting process, no surface damage, no particles and dust, no thermal impact, the equipment has passed the SEMI semiconductor industry certification, entered the mainstream semiconductor packaging and testing factory, and the equipment has completed product development. The intelligent production line for optical waveguide glass wafer laser processing has been delivered.

Huagong Technology also invests in the company's product solution information in the field of connection business in the platform round. With the industry's advanced end-to-end product line and overall solutions, Huagong Technology is committed to becoming a world-class optoelectronic enterprise, serving the world's top communication equipment and data application providers, the company has the vertical integration ability of a full range of products from chips to devices, modules and subsystems, providing customers with intelligent "optical connection + wireless connection" solutions, and its products and technical capabilities are in a leading position in the industry; In the field of intelligent manufacturing business, the company has the leading domestic laser equipment R&D, manufacturing technology and industrial laser field industry chain advantages, and is committed to providing extensive and comprehensive laser intelligent manufacturing solutions for the industrial manufacturing field, as well as providing comprehensive solutions for the "laser + intelligent manufacturing" industry for 3C electronics, automotive electronics and new energy, PCB microelectronics, compound semiconductors, consumer goods and other industries; In the field of perception business, the company has the world's leading R&D and manufacturing technology of PTC and NTC series sensors, and independently masters the core technology of the manufacturing and packaging process of sensitive ceramic chips for sensors, focusing on the main channel of new energy and its upstream and downstream industrial chains, and providing world-leading, multi-dimensional perception and control solutions for new energy and intelligent networked vehicles, photovoltaic energy storage, smart homes, smart grids, smart cities and other fields.