https://event.asme.org/InterPACK/Program/Plenary-Speakers
About InterPACK
The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is the flagship conference of the Electronics and Photonics Packaging Division (EPPD).
Dr. Radha Nagarajan
SVP and CTO
Marvell's Optical and Cloud Connectivity Group
Presentation Title: 2.5D/3D Integration for High-Speed Light Engines
Abstract: Massive deployments of AI data centers have rapidly pushed the speed of optical interconnects from 800Gbit/s to 1.6Tbit/s and beyond, while placing a premium on power, performance and latency.
In this talk, we discuss the use of 3D heterogeneous integration, on silicon photonics, to enable low energy, high density high speed optical interconnects for these applications.
Heterogeneous optical integration in this talk, is where separately manufactured electronic components and semiconductor lasers are assembled on to an active silicon photonics interposer to form a Light Engine.
This process allows for the integration of components independently designed and optimized from several different technology and foundry platforms onto a common interposer.
Biography: Dr. Radha Nagarajan is currently the Senior Vice President and Chief Technology Officer of Marvell's Optical and Cloud Connectivity Group. At Marvell, he manages the development of the company's optical platform technology and products. Concurrently, he is a Visiting Professor at the Department of Electrical and Computer Engineering at the National University of Singapore. He received his B.Eng. from the National University of Singapore, M.Eng. from the University of Tokyo, Japan and Ph.D. from the University of California, Santa Barbara, USA, all in Electrical Engineering.
Dr. Nagarajan's other recognitions include the IEEE/LEOS Aron Kressel Award, the IPRM Award and the Optica David Richardson Medal for breakthrough work in the development and manufacturing of photonic integrated circuits. He was named to Electro Optics’ The Photonics100 in 2024 which honors the industry’s most innovative people. He has been awarded more than 245 US patents and is a Fellow of Optica, IEEE, and IET.
