11-2-15, I only remembered this:

''Brett already discussed the RFQ process, so I will focus on our new product concept. While we are not yet ready to discuss this new technology in detail, because it remains under development, the concept integrates and exploits this trends of our XSense sensor and Diamond Guard Hard Coat material to help manufacturers all sort of the thinnest, lighter, faster and yet most cost effective devices possible to their customers, including low cost effective way to support.''

But they sent some out and got reqest; this new contract could be them and be pleased with it. Maybe this other partner will showcase it at CES:

''We demonstrated a functional prototype of this product concept to number of PC manufacturers and existing partners that was well received. One existing customer immediately requested us to go prototype units for them, while a separately development partner has initiated plans to build a complete system to show case and validate the technology. I followed this time on trip visits to four U.S. manufacturers which resulted in additional evaluation request for tablet, computer and printer projects.

I'm pleased by the initial reception that this new product concept has received from our customers, prospects and partners and look forward to working with them closely as we define and validate the concept''

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