That was a little uncalled for - I may have differences in opinion with SRT, but I believe in this case he is informed as per Wolfy`s reply.
As for that subject Re: MOS inside?, even those test methods would only reveal ``subjective`` evidence - nothing concrete. And enabling conduct of the tests may be a difficuly. If the component involved was an FGPA with MOS embedded, there`s another hurdle, as we were told by EDIG that the security features of the FGPA are such that if the component is tampered with, it`s contents automatically self-destruct.
But I KNOW nuttin`!
SGE
