I believe you are correct, in that we were a 'third-party' to them, but you must remember as we see with Samsung our MicroOS couples the microcontroler to it's related circuitry-buttons-switches-mic in a handheld 'casement' to port digital audio onto removable flash thru internal ROM, ie substrated nonvolitile onto the chip... where IMO mos lies glued to do its thing;. and so many others today, lol.
TI looked a what the Puck did with their DSP, vi porting, and emulated it to the CE world...
But that's teir 2 stuff
fwiw-imvho
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