Free
Message: TI Executive Outlines Advances in Digital Consumer Electronics at COMPUTEX TAIPEI 2005

TI Executive Outlines Advances in Digital Consumer Electronics at COMPUTEX TAIPEI 2005

posted on May 31, 2005 11:46PM
TI Executive Outlines Advances in Digital Consumer Electronics at COMPUTEX TAIPEI 2005

TAIPEI, Taiwan, May 31 /PRNewswire/ -- Wireless communications and digital entertainment are the new driving forces in consumer electronics, said Terry

Cheng, president of Texas Instruments Incorporated (NYSE: TXN) (TI) Asia. In a keynote address delivered today at COMPUTEX forum - IAFA 2005, Cheng emphasized the key issues and technology trends that have emerged at the heart

of this digital revolution.

``TI`s silicon innovation is helping drive the consumer electronics market for home and on-the-go products, such as DLP(TM) TVs, mobile phones and portable media players,`` said Cheng. He added that music, video and images

are moving to digital platforms, providing consumers with the enhanced quality and unprecedented degree of flexibility and control required to embrace these

innovations. He said this will create new end-user experiences, such as playing your favorite online video game via your Internet Protocol TV (IPTV) set top box or watching live digital TV on a 3G handset while waiting to catch a flight.

``The growth and advancement of 3G technology is fueling a number of feature-rich applications, such as digital TV, video, custom ring tones, 3D games and multi-megapixel imaging. By combining these multimedia capabilities

and increased wireless connectivity options into mobile phones, consumers will have mobile entertainment at their fingertips,`` continued Cheng.

Cheng identified wireless market segmentation, emerging global markets, Wi-Fi(R) and Bluetooth(R) networking penetration, and mobile digital TV as industry trends that are shaping tomorrow`s wireless market. ``Leveraging a

broad portfolio of cellular and mobile connectivity technologies, consumer electronics expertise, and cutting-edge manufacturing processes, TI has proven to the market that we are well-positioned to deliver the next generation of portable electronics.``

In his remarks, Cheng also noted that while consumers are embracing today`s innovations, they continue to demand smaller, sleeker, devices with more functionality and longer battery life at a lower cost. TI is meeting

these demands with its innovative DRP(TM) technology, which significantly reduces board space, extends battery life, and makes for a more cost- effective, powerful, versatile mobile phone.

``At TI, we have a keen eye on the road ahead. By actively developing new DSP solutions, higher performance and more power efficient analog products, and through our sophisticated and integrated DRP technology roadmap, TI is at the center of today`s transition to an increasingly digital world.``

About Cheng

As president of TI Asia, based in Taipei, Taiwan, Mr. Cheng oversees five manufacturing facilities, one software and IC development center, six field applications engineering centers, and 13 sales and marketing offices in Asia.

In this role since 1997, he turned in record profitability and growth for TI, making Asia the largest region in terms of semiconductor revenues. He executed a series of strategic initiatives in Asia, including Taiwan wireless

ODM strategy, China joint design centers, and Signal Processing Value-Added Resellers program that fosters innovation in information appliances.

TI at COMPUTEX

TI will exhibit at booth T203AB in hall 4 (TICC, Taipei International Convention Center) during COMPUTEX TAIPEI, held May 31 - June 4. Key TI executives will be available to provide information on the company and the product groups which are wireless, consumer electronics, broadband and connectivity. In addition to Cheng`s keynote, Dr. Kun-Shan Lin, Vice President of TI Greater China Strategic Business Development, will be speaking at DigiTimes Forum on June 1. His topic will be WLAN-From Technology to

Utility.

Texas Instruments - Making Wireless

TI is the leading manufacturer of wireless semiconductors, delivering the heart of today`s wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems

expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs,

OMAP(TM) application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. Please visit http://www.ti.com/wirelesspressroom for additional information.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers` real world signal processing requirements.In addition toSemiconductor, the company`s businesses include Sensors &Controls, and Educational & Productivity Solutions. TI is headquartered inDallas, Texas, and has manufacturing, design or sales operations in more than25 countries.

Texas Instruments is traded on the New York Stock Exchange under thesymbol TXN. More information is located on the World Wide Web athttp://www.ti.com .

Trademarks

DLP, DRP, and OMAP are trademarks of Texas Instruments. All othertrademarks and registered trademarks are property of their respective owners

Share
New Message
Please login to post a reply