RE: Samsung Electronics Develops World`s First Eight-Die Multi-Chip Package Technology for Multimedi

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doni

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RE: Samsung Electronics Develops World`s First Eight-Die Multi-Chip Package Technology for Multimedi

posted on Jan 10, 2005 04:46AM

``The new eight-die MCP uses all the memory devices available today for mobile products in a single 11 x 14 x 1.4mm package. It includes two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.``

just add the..

Special sauce pickles lattice and a Sesame seed bun...

Nor and Nand on the same device....

I would say your guess of Samsung could be on

doni

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