Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: effect of a new CEO on the SP-FG
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mo
Feb 22, 2015 03:00PM
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mo
Feb 22, 2015 03:07PM
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mo
Feb 22, 2015 03:42PM

mo
Feb 22, 2015 03:57PM
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Feb 22, 2015 04:43PM
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Feb 22, 2015 04:58PM

mo
Feb 22, 2015 05:02PM
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Feb 22, 2015 05:06PM

It's the only solution that is economical, readily adaptable to existing Fabs and actually ready.

Sure, there's talk or graphene, diamonds, GeSi, etc.. but who has a product that is ready?

Who has a product:

That is compatible with CMOS?
That can be addapted to existing Fabs?
That can follow Moore's Law?
That applies known Silicon scalling processes?
That doesn't over heat?
That has over 30 years of use in industry?
That can integrate electrical, optical, RF, IR, all in one chip?
That supports universal memory?
That has a promising future in quantum computing?

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