Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: re: new equipment issues
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Apr 09, 2015 05:12PM

No I'm the crazy one on the board. But I would 100% agree with you. "if" they did want to hide overlapping issues, mechanical issues always works. Good thought sir.

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BAE
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