His presentations sounds very interesting:

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Presentation
High speed photonic integrated receivers for 100G and above

Integration of Photonics on chip is necessary to address the future demands of the datacenter. The market demands for low cost, small footprint and low power require innovation in the design of the photonic components. To reduce power and to enable on-chip integration requires designs that enable minimal temperature variation of MUX/De-MUX for the wavelength control and management. BB Photonics is developing a platform approach integrating low loss dielectrics into InP wafers for wavelength routing and functionality to enable mode matched devices that have a low thermal variation. This unique approach reduces size, cost, adds functionality and enables high coupling to the passive waveguides from the III-V components that can then be integrated with Spot-size converters and high-speed waveguide devices. The current work on 100GbE LR4 device integration will be discussed.

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Would be great, if we could find out more about this presentation in March 2016!