By the way,

Bill Ring was also presenting at PIC last year, first of March, for BB Photonic: 

Integration of Photonics on chip is necessary to address the future demands of the datacenter. The market demands for low cost, small footprint and low power require innovation in the design of the photonic components. To reduce power and to enable on-chip integration requires designs that enable minimal temperature variation of MUX/De-MUX for the wavelength control and management. BB Photonics is developing a platform approach integrating low loss dielectrics into InP wafers for wavelength routing and functionality to enable mode matched devices that have a low thermal variation. This unique approach reduces size, cost, adds functionality and enables high coupling to the passive waveguides from the III-V components that can then be integrated with Spot-size converters and high-speed waveguide devices. The current work on 100GbE LR4 device integration will be discussed.

So no need for him to repeat and talk about his technology and the MUX/DEMUX.

I am expecting a nice sum-up of the possibilities of out POET platform and hopefully some recent results!