Re: Denselight now need two Senior R&D Engineers for Photonics Packaging

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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monolithic

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Re: Denselight now need two Senior R&D Engineers for Photonics Packaging

in response to

Denselight now need two Senior R&D Engineers for Photonics Packaging

macnai

posted on Oct 20, 2017 10:06AM

Such hiring for the need to prepare the processes for photonics packaging, to me, confirms/suggests that Denselight will rapidly need expertise to meet integration of InP platform devices for a ramp up to increased sales as per POET's roadmap projections. In hindsight we can see how important the Denselight/BB Photonics acquisitions are now.