Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
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Our own Evan Hueners will be speaking at the Photonics@SG2018 in Singapore on November 26, presenting Advanced Photonic Packaging: Empowering IoT and Beyond. Photonic integrated circuits (PIC) have become an attractive platform for data center, sensing and medical devices. Silicon photonics, in particular, draws great industry attention for its low cost and scalability. However, the packaging and assembly of such devices faces a major challenge due to its stringent placement accuracy requirement for optimal single mode optical coupling. Learn more about attending this talk: https://hubs.ly/H0f8rWR0