Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: Principal Engineer (Photonics IC Packaging R&D)
New Senior Executive job posting for Denselight. 8 hours ago.
Principal Engineer (Photonics IC Packaging R&D)
DenseLight Semiconductors Pte Ltd
Min 8 years (Senior Executive)
Singapore - East - Changi - Changi North Street 2
JOB DESCRIPTION
Job Objectives
To develop Photonics Integrated Circuit packaging design and process capabilities to meet company’s technology and product roadmap.
Duties & Responsibilities
- Product and process development based on DenseLight Hybrid Photonics Packaging (HIPP) Platform
- Develop HIPP products from design, prototyping, to process and product qualification
- Develop Engineering and Manufacturing Specifications for packaging parts and processes
- Develop essential packaging capabilities, including wafer-scale flip-chip assembly & precision dicing, with internal company teams, and outsourced partners & technology tool providers
- Perform analysis on packaging process specs performance, yield, manufacturing cost and cycle-time; and contributes in planning and execution of essential improvement program
- Provides documentation & regular technical reporting, and technical support and coordination with the Company NPI teams to fulfil the Company Technology and Product Development programs.
Job Requirements
- Bachelor Degree in Electrical/Electronic/Computer engineering, Physics, Optical/Photonics engineering and related to one of these is preferred
- Minimum 5 years’ working experience with technical background in electrical/optoelectronics packaging, or optomechanical assembly and test environment
- Work experience in new product and/or new process development and qualification
- Electronic packaging knowledge, with hands-on experience in die-bonder is a must. Photonic packaging knowledge is a plus.
- Hand-on experience with die-assembly tool, flip-chip bonder, wire bonder, and CAD drawing is strongly recommended.
- Understanding with packaging of semiconductor wafer is a plus.
- Knowledge of up-to-date production and automation equipment, processes, designs and functions
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