Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: Principal Engineer (Photonics IC Packaging R&D)

Perhaps it doesn't add up if you are thinking of all the pieces of this puzzle as separate entities.

But, if you think of the purchaser as a subsidiary of another company that is within the realm of the companies POET is presently dealing with and is known to (Accelink, Silterra, etc) and they have already decided on production levels and who will buy what from who and in what quantities, then it makes a lot more sense. Thirty million is realistic to start the process, protect the IP to partner satisfaction and the end game is all the partners see an acceptable cut of a few hundred million annually, in a few years time?

Makes perfect sense

IMO, of course

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