Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: Principal Engineer (Photonics IC Packaging R&D)
Reply New Message
Prev Message Back To Forum Threaded View Next Message

That is a lot of assuming and reading the tea leaves from one perspective Fairchi. I am not into conspiracies or negativity but there is a lot that I can't yet make sense of at this time. In time we will know. Right now I can't read something totally positive.  

7 Recommendations
Reply New Message
Prev Message Back To Forum Threaded View Next Message
Share
Share
New Message
Please login to post a reply