Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: Patent: Vertical cavity surface emitting laser

Reference the highlighted excerpt from ITTR’s post on Sept 29, AGM Transcript 2: Lily Wu’s Talk:

“And just to put a word or two about that, you all know and understand the value of POET and its technologies, from Chinese shareholders’ perspective, DenseLight has two sides of its business. Its larger and primary aspect of its business is actually sensing chips. Sensing chips go into a wide-range of industrial manufacturing applications. China, as you know, is often referred to in the press as the factory of the world. For us, in China, the manufacturing, the industrial, the equipment machining applications of DenseLight are ever so important, perhaps more so than for traditional Western countries for whom manufacturing has mostly migrated out of those countries. So DenseLight has great interest to our investor base, perhaps even more so than it would, for example, to POET who’s more facing leading-edge datacom-type, or telecom-type, applications. Of course we also have that need, so we hope to develop both, but it’s the machining and traditional manufacturing which for us is so important and so valuable to complete our supply-chains, to complete our technology capabilities. So that’s the other side of the DenseLight story and why it’s so meaningful to the Chinese investors.”

 

Although I’m not particularly tech savvy, I’m wondering if applications of this patent could potentially be an important foundation piece for POET’s ongoing commercial relationship with Denselight Shanghai and their Sensor Chip business in China.

killer66

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