When we look at the patent images there are multiple variations designed to cover all the bases for future product development. There is even one for attaching the dielectric stack as a discrete component through 3d bonding. Why they would want to do that?  

Basically what the dielectric provides is a material set that can be deposited on the surface of the silicon wafer at low temperature and at low stress without damaging the underlying circuits or distorting the wafer. In other words the silicon can be processed to provide both interconnection  with electrical conductors and could also provide logic, memory, DSP or any number of requirements perhaps as a separation between analog and digital to allow multiple nodes.  What it creates is a flexible platform and maybe this was what our new president meant by off the shelf components. A multitude of designs for any application requiring optical integration.  He also talked about applicability to programmable logic controllers. In other words it allows for more of a silicon photonics (monolithic) approach where desired.

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