Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Good morning

Live Presentation Denselight: Enabling PIC Solutions Through DPHI

Listen to our Vice President of Sales & Marketing, Soma Sankaran talk about how DenseLight's DPHI packaging technology enables agility, allows increased flexibility and helps customers to deliver new efficiencies.

Date: 18 February, 2021
Time: 17.00pm to 17.10pm

 

 https://www.photonicsplus.com/epic/denselight01

Cheers

 

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