Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Rockley
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So FJ, what ittr highlighted "Suresh on FR4 400G (specifically FR4 400G demultiplexing): “I believe, and we believe, it is the industry’s first wafer-level integration of a FR4 demux—it doesn’t exist in the industry today.” 

 David Lazovsky on 400G and our Tier 1 American partner: “What I can tell you is that technically we have a differentiated product that they want and we’re not sure that they have a solution at 400G FR4 without us.”  So this sounds like what is to be on demo at OFC? according to Vivek's intvw? TIA

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