Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

I also like the editors forward to the published issue, in which he writes about POET's article:

"POET Technologies describes the development and demonstrations of its unique optical interposer that utilizes a CMOS-based design for wafer scale passive assembly of electronic and photonic devices. POET believes their approach can substantially reduce the amount manufactures spend to assemble each module. At present, 70 percent of a device’s costs ties back to assembly; the POET approach slashes assembly costs to just 20 percent."

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