Patent Granted

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Mironclaw

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Patent Granted

posted on Mar 05, 2024 09:55AM

Date of patent : March 5th, 2024

Patent number : 11921156-B2

Inventors : Lucas Soldano, San Jose CA (US); Jing Yang, Singapore (SG); Yong Meng Lee, San Jose (US); Suresh Venkatesan, San Jose CA (US)

Title : Structure and method for testing of PIC with an upturned mirror

https://ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11921156

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