Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Wishing Raju good luck at PIC International today and tomorrow

He is on the only PANEL discussion today. 

Advancing the Frontier of Photonic Integration: Challenges and Innovations in PIC Packaging

And tomorrow

 

Semiconductorization of Photonics using Silicon Optical Interposer

 

https://picinternational.net/speakers

 

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