Chiplink, a leading provider of silicon photonics technology and high-performance optical transceivers, participated in the EA Ethernet Alliance Multi-vendor Optical Networking and Interoperability Demo (EA Booth #1415) during OFC 2024.

Xinsulian showcased its latest silicon photonics transceivers, including 400G and 800G Hyper Silicon Photonics™ transceivers, and conducted joint demonstrations with Arista, Cisco, and Juniper network equipment, as well as multiple platforms such as Anritsu, EXFO, Keysight, Spirent, and VeEX test equipment.

Based on the company's proprietary Hyper Silicon™ platform, the silicon optical module fully embodies the excellent performance of the Silicon Silicon technology platform, which can meet the needs of low-cost and high-reliability optical interconnection applications in hyperscale data centers and artificial intelligence/AI clusters.

Henry Plaessmann, Senior Marketing Director at ChipSpeed, said: "The Ethernet Alliance Interoperability Demo at OFC 2024 showcased the compatibility of Chiplink's 400G and 800G series silicon photonic modules with the world's leading network equipment manufacturers. We are honored to be part of this premier event with many industry partners who are committed to fostering collaboration and innovating networking technologies. ”

We sincerely invite industry professionals attending OFC24 to visit EA Ethernet Alliance booth #1415 and Chipspeed booth #1223 to learn more about the high performance and excellence of its silicon photonic module products.

About Xinsulian

Xinsulian is a leading provider of high-speed silicon optical interconnection solutions for data center and AI cluster applications. Silicon Silicon leverages its proprietary Hyper Silicon™ platform to provide high-performance, low-power optical transceivers for next-generation high-speed connectivity. With a focus on innovation and reliability, Xinsulian is building the future of optical networks. For more information, please visit: www.hyperphotonix.com