Chat GPT's answer to my wafer question, regarding Misubishi's 12" wafers for power semiconductor applications vs. POET's need for OI chips from the wafers:
12" (300mm) wafer used for power semiconductor chips and a wafer used for POET Technologies' Optical Interposers can share some commonalities but typically involve different underlying technologies, depending on the specific application.
Here’s a breakdown:
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12" Wafer for Power Semiconductor Chips:
- Power semiconductor devices, like power transistors or diodes, are often built on materials such as silicon (Si), silicon carbide (SiC), or gallium nitride (GaN). These materials are selected for their ability to handle high voltages, currents, and efficient heat dissipation. The technology used in power semiconductor manufacturing focuses on maximizing electrical performance and energy efficiency in high-power applications.
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Optical Interposer for POET Technologies:
- POET Technologies' Optical Interposer platform involves the integration of photonics (optical) and electronics on a single interposer to enable high-speed data transfer for optical communication. The wafers used for this purpose are typically silicon-based (Si), or could involve more specialized materials like indium phosphide (InP) or silicon photonics (SiPh). These wafers are designed to support photonics-based devices, meaning they have optical waveguides and other components for light manipulation alongside traditional electronic components.
