Re: Patent Application

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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BreadAndCircuses

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Re: Patent Application

in response to

Patent Application

Mironclaw

posted on Oct 17, 2024 07:35PM

I had a peek at the first page of the 109 pages and quit. The takeaway is in the title.

Title : SELF-ALIGNED STRUCTURE AND METHOD ON INTERPOSER-BASED PIC

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