Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: Just another meaningless post, like so many...

What people need to understand is that years and years of development have been required to get silicon photonics to its current state (Rockley Photonics RIP). POET has developed a superior product in a fraction of that time and at a fraction of that cost. It’s new and it will continue to expand in applications at a faster rate than the evolution of silicon photonics. Why? Because it is an integration technology. POET takes the best performing devices available that provide the functionality needed and connects them without compromise. Material sets associated with these devices are optimized for peak performance and longevity independently before they are connected. 

POET produced a Draft White Paper December 2018. Within this paper is following statement:

POET’s Optical Interposer technology provides the equivalent of a wafer level packaging for optical modules and sub-assemblies. The result of utilizing POET’s Optical Interposer technology is the creation of optical modules or sub-assemblies at wafer scale, where by 100’s to 1000’s of complete optical modules are created on a single wafer, bringing the economies of scale of silicon packaging to the world of photonics

The evolution of POET lines up perfectly with the evolution of very high performance mixed signal multichip modules of advanced systems. 

It’s been a long journey my friends but we are very close to giving birth.

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