Pockels: "there are as many packaging methods as there are platforms (in fact there's probably 10x packaging methods per platform)."

This may be true Pockels.  However, what you have failed to mention is that the vast majority of these use archaic packaging methods, one module at a time.  Less than a handful can scale the way POET can, and of these POET is the superior solution.

Pockels: "TFLN won't cut it long term and is not a scalable solution for millions of unit. "

Absolutely not true.  Please refer to POET 2022 AGM presention, slide 8.  in fact, POET has developed an optical interposer based INTEGRATED lithium niobate chiplet, for this very purpose, and scalable for mass production.  As the slide is titled:  Optical Interposers for Integrating New Materials

Ah, the Power of the Platform TM

I agree LWLG's modulators could be used by POET if ever commercialized and fully accepted by industry.  However, POET doesn't actually need them to reach 1.6 (with DML) and 3.2T (with EML) for these solutions.  In fact, one could argue LWLG needs companies like POET and others who have the capability to integrate entire solutions at scale, rather than adding components such as modulators piecemeal as it commonly done today.  This is exactly what Dr Lebby was referring to in the recently discussed video.  Put another way, they need POET (or someone like POET) more than POET needs them.