Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
Reply New Message
Back To Forum List View
Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
36
Stubbel01
Nov 30, 2019 06:59PM
Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
30
killer66
Nov 30, 2019 09:52PM
Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
13
Babaoriley
Nov 30, 2019 10:07PM
Icon president Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
42
fairchijisback
Dec 01, 2019 05:23AM
Icon president Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
30
fairchijisback
Dec 01, 2019 05:30AM
Icon president Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
20
fairchijisback
Dec 01, 2019 06:02AM
Icon president Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
25
fairchijisback
Dec 01, 2019 06:36AM
Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
15
54-40
Dec 01, 2019 08:18AM
Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
14
Babaoriley
Dec 01, 2019 09:09AM
Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
10
chr6is
Dec 01, 2019 09:35AM
Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
17
LookinGIntoIt
Dec 01, 2019 09:42AM
Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
14
norret
Dec 01, 2019 10:17AM
Icon president Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
26
fairchijisback
Dec 01, 2019 12:35PM
DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
12
Moska
Dec 01, 2019 12:39PM
Icon president Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
32
fairchijisback
Dec 01, 2019 01:17PM
Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
6
turr
Dec 01, 2019 03:45PM
Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
6
Moska
Dec 02, 2019 09:24AM

Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

posted on Dec 02, 2019 11:25AM
Log in to use the IP Check tool [?]

No other company has it Moska as of today.

------------

I guess I was asking if the patent they just secured is broad enough so as to ensure that NO ONE will be able to have ANY KIND of wafer-level testing without either infringing or paying royalties. 

10 Recommendations
Icon president Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
22
fairchijisback
Dec 02, 2019 03:24PM
Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
10
sulasailor
Dec 03, 2019 04:08AM
Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
1
np56
Dec 03, 2019 07:47AM
Reply New Message
Back To Forum List View
Share
Share
New Message
Please login to post a reply